2024-2025 Academic Catalog 
    
    Nov 24, 2024  
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2024-2025 Academic Catalog

ME 7130 - Mechanics of Electronic Packaging


Credit Hour(s): 3

Course Description: Stress and strain analysis of microelectronic packages and assemblies using analytical, experimental, and numerical methods.

Enrollment Restrictions: Must be enrolled in one of the following levels: Graduate, Medical, Professional. Must be enrolled in one of the following colleges: College of Egr & Computer Sci.

Course Level: Graduate
Schedule Type(s): Lecture

Grade Mode: Standard
An additional fee is associated with this course.
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