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May 02, 2024
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2023-2024 Academic Catalog
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ME 7130 - Mechanics of Electronic Packaging Credit Hour(s): 3 Stress and strain analysis of microelectronic packages and assemblies using analytical, experimental, and numerical methods. Enrollment Restrictions: Must be enrolled in one of the following Levels: Graduate, Medical, Professional. Must be enrolled in one of the following Colleges: College of Egr & Computer Sci.
Level: Graduate Schedule Type(s): Lecture
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